User manual LEICA BOND-III BROCHURE

[. . . ] [. . . ] This delivers less maintenance, waste disposal costs and environmental impact. A full range of high-efficiency management features means less staff intervention, providing more time for what matters most. LEAN HISTOLOGYTM WORKFLOWS EASY CONTAINER MANAGEMENT LESS REAGENT MANAGEMENT STREAMLINED MADE SIMPLE Designed to optimize Lean Histology workflows, Bond-III increases uptime and reduces waste, while also providing LIS connectivity, eliminating the need for data entry. High-capacity containers require less reagent and waste management, and can be filled without removal from the instrument. Real-time fluid status allows more efficient reagent management. Enhanced, easy-to-use software interface requires minimal staff time to learn and manage, and flexible modularity enables seamless addition of any member of the Bond family for expanded capacity as your lab grows. 4 5 Bond-III TM Q U A L I T Y really matters At Leica Microsystems, quality is at the heart of Total Histology. TM With three generations of superior Bond staining consistency, Bond-III assures delivery of clear and accurate staining for unsurpassed diagnostic confidence. Quality matters to us because it matters to you, and your patients. COVERTILETM TECHNOLOGY STAINING REAGENTS COMPACT POLYMERTM DETECTION QUALITY THAT'S CUSTOMIZED Leica Microsystems' patented Covertile ensures gentle tissue care and low volume, uniform reagent coverage throughout the staining process, preserving tissue integrity and minimizing repeats. A full range of Bond ready-to-use antibodies designed with NovocastraTM Science is preoptimized for Bond to ensure consistently high-quality staining. High concentration of enzyme for each antibody assures stains are crisp and well-defined, providing highly sensitive detection and specificity without background staining. The flexibility within our advanced software allows simple customization and control of staining quality, matching the protocol to the needs of your lab and your pathologists. 6 7 Bond-III SYSTEM SPECIFICATIONS Weight (dry) Processing temperature Slide capacity Reagent container capacity Number of reagent containers Dispense volume Modularity Waste disposal System mounting Database Laboratory information system (LIS) integration 246 kg (243 lb) Ambient to 100°C 3 independent trays of 10 slides 30 slides total capacity 7 mL or 30 mL 36 (4 trays of 9) 150 µL 5 processing modules per controlling PC. Any combination of Bond-x , Bond-max and Bond-III TM TM TM Separation of hazardous and nonhazardous waste Freestanding Full tracking and reporting of all slides Full tracking and traceability of reagent lot numbers, expiration dates and usage Optional upgrade package, compatible with HL7 v2. 4/2. 5 and LIS02-A2 (ASTM 1394) SYSTEM COMPARISON High-Quality Staining Efficiency Ease of Use Speed of Processing Bond-max ··· ·· ·· ·· Bond-III ··· ··· ··· ··· Leica Microsystems ­ an international company with a strong network of customer services The Bond system is available through the following offices: North America Sales orders/Customer support 800 248 0123 Asia/Pacific Sales orders/Customer support Aus 1800 246 797 Sales orders/Customer support NZ 0800 400 589 Europe/Middle East/Africa Sales orders/Customer support UK 0800 298 2344 Sales orders/Customer support ROI 1800 242 612 Sales orders/Customer support EU +44 1908 246 246 www. leica-microsystems. com 8 © Leica Microsystems GmbH · HRB 5187 · 09/2009 · 95. 8385 Rev B Processing module dimensions 775 mm x 785 mm x 1, 359 mm (30. 51 in x 30. 91 in x 53. 50 in) [. . . ] [. . . ]